Amavili okuSila ngedayimane: Isikhokelo esipheleleyo kwiiMpawu, iTech, i-Advantages kunye nezicelo

Yintoni iDayimane yokuSila amavili?

Amavili okusila idayimani zizixhobo ezirhabaxa ezenziwe ngamacandelo amathathu angundoqo:

I-Diamond Abrasive Grain: Indawo yokusika, eyenziwe ngedayimane yendalo (enqabileyo, enexabiso eliphezulu) okanye idayimane yokwenziwa (ixhaphake kakhulu, ilungiselelwe ukuhambelana). Iinkozo zedayimani zokwenziwa zidla ngokugqunywa (umzekelo, nge-nickel okanye i-titanium) ukuphucula ukuncamathela kwibhondi kunye nokuxhathisa ukunxiba.
I-Bond Matrix: Ibamba iinkozo zedayimani kwindawo kwaye ilawule ukuba iinkozo "ziqhekeka" ngokukhawuleza kangakanani (ukunxiba) ngexesha lokusetyenziswa. Iindidi zebhondi eziqhelekileyo ziquka i-resin, isinyithi, i-vitrified, kunye ne-electroplated (ngakumbi kule nto kwicandelo loLwazi lwezoBugcisa).
I-Pore Structure: Izikhewu ezincinci phakathi kwebhondi kunye neenkozo ezivumela ukuhamba okupholileyo, ukususwa kwe-chip, kunye nokuthintela ukuvala-kubalulekile ukugcina ukuchaneka kwizicelo zokushisa okuphezulu.

Iimpawu eziphambili zeDayimane zokuSila amavili

Amavili okugaya idayimani achazwa ngeempawu ezenza ukuba zilungele izinto ezicela umngeni. Nazi ezona zibalulekileyo ekufuneka uziqwalasele:

1. Ukuqina okuKhethekileyo kunye noKuxhathisa ukuNxitywa

Idayimani ibeka i-10 kwisikali sobunzima be-Mohs (esona siphezulu sinokwenzeka), oku kuthetha ukuba inokugaya izinto ezinobunzima ukuya kwi-9 Mohs-kuquka i-alumina ceramics, i-silicon carbide, iglasi, kunye ne-tungsten carbide. Ngokungafaniyo ne-aluminium oxide okanye amavili e-silicon carbide (eguga ngokukhawuleza kwizinto eziqinileyo), amavili edayimane agcina imilo yawo kunye nokusika ukusebenza kakuhle kwe-50-100x ixesha elide, ukunciphisa iindleko zokutshintshwa kwesixhobo.

2. Ubuchule bokuSila obuchanekileyo

Ngobukhulu obuziinkozo obucokisekileyo njenge-0.5 μm (micrometers), amavili edayimani afikelela kumphezulu wokugqiba agudileyo njengeRa 0.01 μm—ebaluleke kakhulu kumacandelo okukhanya, i-semiconductor substrates, kunye nezixhobo zonyango apho nokuba ukungafezeki okuncinci kubangela ukusilela.

3. Ukumelana nobushushu kunye nokusika okupholileyo

Idayimane ine-thermal conductivity 5x ephezulu kunobhedu, evumela ukuba ikhuphe ukushisa ngokukhawuleza ngexesha lokugaya. Oku kunciphisa “umonakalo wobushushu” (umzekelo, iintanda, ukutsha, okanye i-warping yezinto) kwizinto ezingeva bubushushu njengeglasi, iquartz, kunye neeseramikhi eziphambili.

4. Ukwenziwa ngokwezifiso

Abavelisi balungisa amavili edayimani kwizicelo ezithile ngokulungelelanisa:

Ubungakanani bengqolowa (i-coarse yokususwa kwezinto ezikhawulezayo, ilungile ukugqiba).
Uhlobo lwebhondi (i-resin yokusetyenziswa kobushushu obuphantsi, isinyithi sokugaya i-heavy duty).
Imilo yevili (umcaba, ikomityi, isitya, okanye iradiyasi) ukuze itshatise ijometri yesixhobo sokusebenza.

Ulwazi lobuGcisa: Indlela amavili okugaya iDayimane asebenza ngayo

Ukukhetha ivili ledayimane elichanekileyo, ukuqonda iinkcukacha zayo zobugcisa kubalulekile. Ngezantsi ezona parameters zibaluleke kakhulu zobugcisa:

1. Uhlobo lweBond: "Umqolo" wesondo

Ibhondi imisela ukuqina kwevili, isantya sokusika, kunye nokufaneleka kwezinto ezahlukeneyo. Nantsi indlela iintlobo ezine eziphambili zokuthelekisa:

Uhlobo lweBond	Iimpawu eziphambili	Engcono Kwi
Resin Bond	I-Flexible, isizukulwana esisezantsi sokushisa, ukusika ngokukhawuleza. Iqhekeza kancinci kancinci ukubonisa iinkozo zedayimani ezintsha.	Ukugqiba imisebenzi (umzekelo, iglasi ye-optical, ii-wafers ze-semiconductor), izinto ezithandwa ngumonakalo we-thermal.
Metal Bond	Ubunzima obuphezulu, ukumelana nokunxiba, kunye nokuqina. Ilungele ukususwa kwempahla enzima.	Ukugaya iintsimbi ezinzima (i-tungsten carbide), ikhonkrithi kunye nelitye. Ifuna into yokupholisa ukunqanda ukushisa okugqithisileyo.
Vitified Bond	Ukumelana nobushushu obuphezulu, ukugcinwa kobume obugqwesileyo, kunye nokuvala okuphantsi.	Ukusila ngokuchanekileyo kweekeramics, izixhobo ze-carbide, kunye nentsimbi yokuthwala. Isetyenziswa kumatshini wokugaya ngesantya esiphezulu (HSG).
Electroplated Bond	Umaleko obhityileyo, oshinyeneyo webhondi kunye neenkozo zedayimani ezivelileyo. Inikezela ngobuchule obuphezulu bokusika.	Ukusila okuneprofayili (umzekelo, iincakuba zeinjini yomoya, imingxuma yokungunda) kunye nemveliso yeebhetshi ezincinci.

2. Ukugxilwa kweDayimane

Ugxininiso lubhekiselele kubungakanani beenkozo zedayimani kwivili (elilinganiswa njengeekharati ngecubic centimeter nganye). Ugxininiso oluqhelekileyo luqala kwi-50% ukuya kwi-150%:

50–75%: Ukusila okulula (umzekelo, iglasi yokugqiba).
I-100%: Ukugaya injongo ngokubanzi (umzekelo, izixhobo ze-carbide).
I-125–150%: Ukugaya umsebenzi onzima (umzekelo, ikhonkrithi, ilitye).

Ugxininiso oluphezulu = ubomi bevili elide kodwa ixabiso eliphezulu.

3. Ubungakanani beenkozo

Ubungakanani benkozo bubhalwe ngenani lomnatha (umz., 80# = rhabaxa, 1000# = fine) okanye ubungakanani bemicrometer (μm). Umgaqo wesithupha:

Iinkozo ezirhabaxa (80#–220#): Ukususwa kwezinto ezikhawulezayo (umzekelo, ukumila iibhloko zeseramikhi).
Iinkozo eziphakathi (320#–600#): Ukususwa nokugqiba ngokulungeleleneyo (umzekelo, ukugalela ii-carbide ezifakwayo).
Iinkozo ezintle (800#–2000#): Ukuchaneka okuphezulu kokugqibezela (umzekelo, iilensi zamehlo, ii-wafers zesemiconductor).

4. Isantya sevili

Amavili edayimani asebenza kwizantya ezithile zomda (olinganiswa ngeemitha ngesekhondi, m/s) ukunyusa ukusebenza:

Ibhondi ye-resin: 20-35 m / s (ephantsi ukuya kwisantya esiphakathi).
Ibhondi yensimbi: 15-25 m / s (isantya esiphakathi, sifuna ukupholisa).
Ibhondi ye-Vitrified: 30-50 m / s (isantya esiphezulu, esilungele i-HSG).

Ukugqithisa isantya esicetyiswayo kunokubangela ukuba ivili liqhekeke okanye iinkozo zedayimane zikhuphe.

Izinto eziluncedo zeDayimane yokuSila amavili ngaphezulu kwee-Abrasives zeMveli

Amavili abrasive emveli (umzekelo, i-aluminiyam oxide, isilicon carbide) anexabiso eliphantsi, kodwa ayasilela ekusebenzeni xa kusila izinto eziqinileyo okanye ezichanekileyo. Nasi isizathu sokuba amavili edayimani elufanele utyalo-mali:

1. Ubomi besixhobo eside

Njengoko bekutshiwo ngaphambili, amavili edayimani ahlala kangange-50-100x ubude kunamavili e-aluminiyam oxide xa kusila izinto ezinzima. Ngokomzekelo, ivili ledayimani lingakwazi ukugaya i-10,000 ye-carbide efakwe ngaphambi kokuba ifune ukutshintshwa, ngelixa ivili le-aluminium oxide linokusingatha i-100 kuphela.

2. Ubuchule bokuSila obuPhezulu

Ubulukhuni bedayimani buvumela ukuba inqumle izinto ngokukhawuleza kuneziqholo zemveli. Umzekelo, ukugaya ipleyiti ye-alumina ye-alumina engqindilili ye-10mm enevili ledayimani kuthatha imizuzu emi-2 ukuya kweye-3, xa kuthelekiswa nemizuzu eyi-10-15 ngevili le-silicon carbide.

3. Umgangatho oPhezulu womphezulu

Amavili emveli ahlala eshiya "imikrwelo" okanye "i-micro-cracks" kwizinto ezinzima, ezifuna amanyathelo ongezelelweyo okugcoba. Amavili edayimani avelisa ukugqiba okufana nesibuko kwipasi enye, ukuphelisa imfuneko yokucubungula emva kokugaya kunye nokugcina ixesha.

4. UkuNcitshiswa kweNkunkuma yezinto

Ukugaya ngokuchanekileyo ngamavili edayimani kunciphisa "ukugaya ngokugqithiseleyo" (ukususa izinto ezininzi kunokuba kuyimfuneko). Oku kubalulekile kwiimathiriyeli ezibizayo ezifana neewafers zesemiconductor (apho iwafer enye inokubiza i-$1,000+) okanye iiseramikhi zodidi lwezonyango.

5. Ukuguquguquka

Ngokungafaniyo namavili emveli (athintelwe kwisinyithi okanye izinto ezithambileyo), amavili edayimani agaya uluhlu olubanzi lwesubstrates: iglasi, iquartz, iiseramics, i-carbide, ilitye, ikhonkrithi, kunye nezinto ezenziweyo ezifana ne-carbon fiber reinforced polymer (CFRP).

Izicelo: Apho Kusetyenziswa amavili eDayimane okuSila

Amavili okusila idayimani abalulekile kumashishini afuna ukuchaneka kunye nokuqina. Apha ngezantsi kukho iimeko zabo zokusetyenziswa eziqhelekileyo:

1. ISemiconductor & Electronics Industry

Iiwafers zesilicon zokusila (ezisetyenziswa kwiimicrochips) ukuphumeza imiphezulu ethe tyaba (± 0.5 μm flatness).
I-Shaping gallium arsenide (GaAs) kunye ne-silicon carbide (SiC) substrates kumbane wamandla kunye nezixhobo ze-5G.
Ukucwenga iitshiphusi ze-LED zokuphucula ukuphuma kokukhanya.

2. I-Aerospace & Automotive

Iincakuba zeinjini yokugaya (ezenziwe ngetitanium okanye i-Inconel) ukuya kukunyamezelana okuqinileyo (±0.01 mm) ukuze injini isebenze kakuhle.
Ukubumba iidiski ze-ceramic brake (ezisetyenziswa kwiimoto eziphezulu zokusebenza) ukuxhathisa ukushisa kunye nokuphila ixesha elide.
Ukugqiba amasuntswana esixhobo se-carbide (esetyenziswa kumatshini wenjini yenqwelomoya) ukugcina imiphetho ebukhali.

3. I-Optical & Medical Industries

Ukuhombisa iilensi zamehlo (iglasi okanye iplastiki) yeekhamera, iiteleskopu, kunye neendondo zamehlo ukufikelela kwindawo engenamkrwelo.
Ukusila izifakelo zonyango (umzekelo, amalungu enyonga yeceramic, izikrufu zethambo le-titanium) ukuhlangabezana nemigangatho ye-biocompatibility kunye nokufaneleka okuchanekileyo.
Ukubumba ii-quartz crucibles (ezisetyenziswa kwimveliso ye-semiconductor) ukubamba i-silicon etyhidiweyo.

4. Ulwakhiwo kunye nokuLungiswa kwaMatye

Ukusila imigangatho yekhonkrithi ukwenza umphezulu ogudileyo, umgangatho wezakhiwo zorhwebo.
Ukubumba ilitye lendalo (imarble, granite) kwii-countertops, iithayile, kunye nezikhumbuzo.
Ilitye elenziwe ngobunjineli (umzekelo, i-quartzite) ukuphucula ubuhle balo.

5. Isixhobo kunye neDie Manufacturing

Ukulola i-carbide end Mills, i-drill, kunye nezixhobo ze-punch ukubuyisela ukusebenza kokusika.
Ukugaya imingxunya yokungunda (esetyenziswa ekubumbeni inaliti yeplastiki) ukuchaneka imilo kunye nokugqitywa komphezulu.

Indlela yokukhetha ivili lokuSila leDayimane eliLungileyo

Ukukhetha ivili elichanekileyo kuxhomekeke kwizinto ezintathu:

I-Workpiece Material: Khetha uhlobo lwebhondi oluhambelana nobulukhuni bemathiriyeli (umzekelo, ibhondi yentsimbi yekhabhide, ibhondi yeresin yeglasi).
Injongo yokuSila: Iinkozo ezirhabaxa zokususwa kwezinto, iinkozo ezicolekileyo zokugqitywa.
Ukuhambelana komatshini: Qinisekisa isantya sevili kunye nobukhulu buhambelana neenkcukacha zomatshini wakho wokusila.

Umzekelo:

Ukuba ucola i-silicon wafer (ethambileyo, ayivani nobushushu), ivili lebhondi yeresin ene-1000# yengqolowa ifanelekile.
Ukuba ubumba isixhobo se-tungsten carbide (inzima, inzima-umsebenzi), ivili lebhondi yentsimbi kunye ne-220 # okuziinkozo isebenza kakuhle.

Ixesha lokuposa: Aug-31-2025